Device and method for increasing the reliability of a power module
US11929346B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2021 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Apr 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention concerns a method and a device for increasing the reliability of a power module composed of plural power semiconductors that are connected in parallel, the power semiconductors being connected to the external pins of the package of the power module through metallic connections. The invention: —selects one power semiconductor among the power semiconductors connected in parallel according to a criterion, —applies a same input patient to the not selected power semiconductors connected in parallel, —increases the temperature of the selected power semiconductor in order to reach a target temperature of the power semiconductor during a time duration in order to achieve and interface grain homogenisation of the metallic connections of the selected power semiconductor, —applies the same input pattern to the selected power semiconductor after the time duration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.