Acoustic wave device and forming method thereof
US11929730B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2021 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Jan 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/021
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.