3D visualization of multi-layer networks including network topology and encapsulation
US11929881B2 · kind B2 · utility
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25References
20Claims
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Key dates
| Filing date | Jan 23, 2023 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Jan 23, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D30/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Three-dimensional (3D) visualization of multi-layer networks include receiving data associated with a network, wherein the network includes interconnected network elements that operate at a plurality of levels that include any of network layers and encapsulations; displaying a plurality of three-dimensional icons each represent one of a plurality of network elements of the interconnected network elements; and displaying links between the plurality of three-dimensional icons each link representing one of a network layer connection and an encapsulation connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.