Vapor chambers
US11930620B2 · kind B2 · utility
2Cited by
22References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2020 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Jul 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.