Devices with low melting point alloy for control of device flexibility
US11931893B2 · kind B2 · utility
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6References
12Claims
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Key dates
| Filing date | May 12, 2020 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Dec 7, 2042 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2017/00955
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A continuum device/manipulator includes a first flexible tube, a low melting point (LMP) alloy disposed within the first flexible tube, and a temperature adjustment element that applies heat or cooling to change a phase of the LMP alloy. Changing the phase of the LMP alloy controls a flexibility of the first flexible tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.