Clamp assembly
US11933436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2020 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Aug 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02G1/04
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for securing a bundle of wires to a surface via a clamp assembly is disclosed. The assembly includes a clamp, such as a P-clamp, that may be mounted to a support before installing a bundle of wires. The clamp includes first and second clamp members that cooperate to form an opening through which the wire bundle extends. The first and second clamp members may be engaged with and disengaged from one another without a tool. In some embodiments, the P-clamp includes a snap-in mechanism with a clip and a corresponding housing. In some embodiments, the clamp includes an inner cushion that allows the clamp to accommodate a range of wire bundle diameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.