Modular leak repair
US11933446B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2020 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Nov 23, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16L55/179
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A modular enclosure system and method for repair of one or more leaks in a pipe. The modular enclosure system including a first enclosure portion configured to be disposed in a mated configuration to create a first enclosure around the pipe. Each enclosure includes a first void section configured to enclose a pipe section of the pipe. Sealant grooves extend along enclosure faces of each enclosure to seal the modular enclosure system. Each enclosure includes a sealant control system having a plurality of blocking members and configured to selectively block sealant injected in the sealant grooves. Each of the blocking members are positionable between a blocking position configured to block sealant flow in at least one of the sealant grooves and a non-blocking position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.