PMU-side thermal control
US11934240B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2022 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Jun 3, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Techniques are disclosed relating to thermal control implemented by a power management unit. In some embodiments, the power management unit itself is configured to monitor thermal conditions, implement control for one or more thermal loops, and send reduction alerts, via an inter-chip interconnect, to the processor circuitry it powers. In some embodiments, the power management unit implements both thermal and electromigration control loops. Disclosed techniques may advantageously reduce or avoid thermal issues, potentially with reduced impact on processor performance relative to traditional techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.