Method and system for fingerprint sensor evaluation
US11935319B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2021 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Nov 2, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R27/26
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of evaluating a dielectric structure, comprising the steps of a) changing a potential difference between each sensing structure in a first set of sensing structures and each sensing structure in a second set of sensing structures, and to providing, for each sensing structure in the first set of sensing structures, a sensing signal indicative of a strength of a capacitive coupling between each sensing structure in the second set of sensing structures and the sensing structure in the first set of sensing structures; b) assign other sensing structures to the first set of sensing structures and the second set of sensing structures; c) performing step a) and step b) until a respective sensing signal has been provided for each sensing structure in the plurality of sensing structures; and d) providing an evaluation result based on the respective sensing signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.