Cleaning machine and cleaning method
US11935737B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2021 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Feb 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6776
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed in the present disclosure are a cleaning machine and a cleaning method. The cleaning machine includes: a wet cleaning module, configured to execute a wet cleaning process on a wafer; a dry cleaning module, configured to execute a dry cleaning process on the wafer; a conveying module, configured to input the wafer into the wet cleaning module or the dry cleaning module, or output the wafer from the wet cleaning module or the dry cleaning module; a transferring module, configured to transfer the wafer from the wet cleaning module to the dry cleaning module or transfer the wafer from the dry cleaning module to the wet cleaning module; and a processing module, configured to extract gas from the transferring module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.