Temperature control for multiple die types in a common package
US11935796B2 · kind B2 · utility
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2References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 23, 2021 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Feb 5, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/0409
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Techniques for temperature control for multiple dies in an element. A temperature of a first die is measured, in an element comprising the first die and a second die. The second die includes at least a portion of a controller. The temperature of the first die is changed by adjusting activity, from the second die to the first die, based on a target temperature for the first die and the measured temperature for the first die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.