Integrated circuit package lids with polymer features
US11935799B2 · kind B2 · utility
0Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2019 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Nov 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.