Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrate
US11935822B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2021 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Sep 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49894
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The conductor pad is formed such that a central axis of the conductor pad is shifted in a predetermined direction with respect to a central axis of the via conductor, and the metal post is formed such that a central axis of the metal post is shifted in the predetermined direction with respect to the central axis of the conductor pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.