Output-integrated transistor amplifier device packages incorporating internal connections
US11936342B2 · kind B2 · utility
1Cited by
5References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2021 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Aug 31, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal to the output lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.