Structure for circuit interconnects
US11937368B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Apr 5, 2021 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Aug 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.