Traceability of subsequent layer structure manufacturing of main body for component carriers by means of laterally and vertically displaced information carrying structures
US11937369B2 · kind B2 · utility
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Key dates
| Filing date | Mar 28, 2019 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Oct 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier related body which includes a stack with a plurality of electrically conductive and/or electrically insulating layer structures, and at least two information carrying structures formed vertically displaced on at least two different of the layer structures, wherein at least two of the at least two information carrying structures are laterally displaced in a plan view on the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.