Heater apparatus-integrated top cover for a computing device
US11937396B2 · kind B2 · utility
0Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2022 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Jan 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/03
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computing device includes a top cover, a heater apparatus, a plurality of temperature sensors, and a heating control component. The heater apparatus includes a heater component and a connector, and the heater component is affixed to the top cover. The plurality of temperature sensors are operatively connected to the heating control component. The heating control component configured to manage the heater apparatus using the plurality of temperature sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.