Superconducting quantum computing circuit package
US11937517B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2019 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Sep 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N69/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A superconducting quantum computing circuit package (1). The package contains a substrate (2) on which a circuit is formed, the circuit including a plurality of circuit elements. The substrate (2) includes holes (8) arranged between the circuit elements which extend through a thickness of the substrate (2). The package also contains a holder (3) with a surface (9) on which the substrate (2) is received, and a cover (4) arranged on an opposite side of the substrate (2). The holder (3) and the cover (4) are formed from a metal and/or a superconductor. The holder (3) also contains projections (12) arranged on and projecting from the surface (9). The projections (12) protrude through the holes (8) in the substrate (2) and contact the cover (4) so to suppress electromagnetic modes in the frequency range of operation of the quantum computing circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.