Ultrasound phased array patch on flexible CMOS and methods for fabricating thereof

US11937981B2 · kind B2 · utility

Assignee

• The Trustees of Columbia University in the City of New York · US

Inventors

• Kenneth L. Shepard · Johnstown, US
• Tiago Costa · Vila Nova de Famalicão, PT
• Kevin Tien · New York, US
• Chen Shi · Beijing, CN

Key dates

• Filing date: Dec 27, 2017
• Grant date: Mar 26, 2024
• Expiry date: Oct 26, 2039

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61N2007/0095
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

An ultrasound phased array integrated in flexible CMOS technology is provided. The CMOS IC chip is fabricated through various chip-thinning techniques, resulting in mechanical flexibility, robustness, and minimized mechanical loading for the piezoelectric transducers. The ultrasound phased array CMOS patch can allow for the generation of high intensity focal regions for maximum penetration in regions of interest.