Method for treating copper-containing waste etching solution
US11939229B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2022 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Nov 18, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC02F2305/08
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
The present invention provides a method for treating a copper-containing waste etching solution, which includes: preparing basic copper chloride nanometer seed crystals and synthesizing basic copper chloride mono-crystals; making an acidic waste etching solution subjected to agglomeration reaction with an ammonium-containing solution and slurry containing the basic copper chloride mono-crystals to obtain basic copper chloride crystal particles and copper-removed waste solution; making an alkaline waste etching solution react with sulfuric acid to obtain a copper sulfate mixed solution; and then evaporating, concentrating, cooling and crystallizing the copper sulfate mixed solution obtained by the reaction of the alkaline waste etching solution and the sulfuric acid in sequence to obtain copper sulfate pentahydrate solids. In a case of low investment, the present invention not only can realize the recycling of copper in the copper-containing waste etching solution, but also can obtain various high-value products, and can achieve both environmental and economic benefits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.