Composite polyimide film, producing method thereof, and printed circuit board using same
US11939439B2 · kind B2 · utility
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0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Mar 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.