Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board
US11939450B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2022 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0266
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.