Resin composition for bonding semiconductor and adhesive film for semiconductor using the same
US11939494B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Aug 17, 2021 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Aug 17, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/005
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.