Patent · US Active

Curable adhesive composition for multi-purpose bonding applications

US11939496B2 · kind B2 · utility

0Cited by

6References

19Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Hendrik Luetzen · Munich, DE
Patrick Seggewiss · Dressendorf, DE
Thomas Kamm · Cologne, DE
Jose Garcia Miralles · Dressendorf, DE
Olaf Hartmann · Jena, DE

Key dates

Filing date	Oct 24, 2022
Grant date	Mar 26, 2024
Priority date	—
Expiry date	Oct 24, 2042

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08G2650/50
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention relates to a curable adhesive composition based on acetoacetate compound, and to its use in multi-purpose bonding applications. In particular, the present invention relates to a curable adhesive composition based on a multifunctional acetoacetate compound and polyoxyalkylene polyamines.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.