Water borne dry lamination bonding agent with heat resistance improvement
US11939498B2 · kind B2 · utility
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3References
19Claims
0Family size
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Key dates
| Filing date | Apr 11, 2017 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Sep 14, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2493/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure is directed to a two-component bonding agent composition and a process for applying a layer of the bonding agent composition to substrate layers to make laminates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.