Diecut especially for permanently closing holes
US11939500B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2021 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Mar 12, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2433/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Diecuts and methods for closing of holes in metal sheets or in plastics parts are disclosed. The diecuts have a carrier composed of an assembly that comprises a metallic first layer having a thickness of 10 to 40 μm, a second layer of a woven or laid glass fabric having a basis weight of 30 to 200 g/m2, an optional first adhesive third layer, an unexpanded expandable graphite fourth layer having a thickness of at least 0.2 to 3.0 mm, and a second adhesive fifth layer. The expandable graphite being present in the fourth layer to an extent of at least 80 wt % and fifth layer being formed by an adhesive having a basis weight of 300 to 1800 g/m2 and/or a thickness of 400 to 1800 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.