Patent · US Active

Diecut especially for permanently closing holes

US11939500B2 · kind B2 · utility

0Cited by
13References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 28, 2021
Grant dateMar 26, 2024
Priority date
Expiry dateMar 12, 2042

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2433/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Diecuts and methods for closing of holes in metal sheets or in plastics parts are disclosed. The diecuts have a carrier composed of an assembly that comprises a metallic first layer having a thickness of 10 to 40 μm, a second layer of a woven or laid glass fabric having a basis weight of 30 to 200 g/m2, an optional first adhesive third layer, an unexpanded expandable graphite fourth layer having a thickness of at least 0.2 to 3.0 mm, and a second adhesive fifth layer. The expandable graphite being present in the fourth layer to an extent of at least 80 wt % and fifth layer being formed by an adhesive having a basis weight of 300 to 1800 g/m2 and/or a thickness of 400 to 1800 μm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.