Electrical connection test for unpopulated printed circuit boards
US11940481B2 · kind B2 · utility
0Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jul 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments relate to a test method for testing an unpopulated printed circuit board. The method can involve the steps of: exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a first step; and testing the electrical connections of the unpopulated printed circuit board. Embodiments also relate to a test device and a method for producing populated printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.