Sensor control assembly and manufacturing device
US11940777B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Sep 16, 2019 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Dec 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L9/50
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A sensor control assembly and method providing a secured sensor data and an optimized handling of the sensor including a sensor, a first processing unit adapted to provide a cryptographic checksum of sensor data, a distributed database, a second processing unit adapted to verify the sensor data, and a third processing unit adapted to determine the demand for calibration. A manufacturing device contains at least a part of the sensor control assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.