Supportable package device and package assembly
US11942263B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Nov 4, 2019 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jun 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A package device can include: a package body having a support body and an encapsulating body configured to encapsulate a conductive body of the package device; at least one extraction electrode electrically connected to the conductive body, and having a part exposed outside the package body; and where the support body is located on only part of a bottom surface of the encapsulating body, and protrudes from the bottom surface of the encapsulating body to form a cavity defined by the remaining exposed bottom surface of the encapsulating body and inner side surface of the supporting body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.