Thermal resistor and method of manufacturing the same
US11942392B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2022 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jun 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC device includes first and second resistors. The first resistor includes first and second metal segments extending in a first direction in a first metal layer, and a third metal segment extending in a second direction in a second metal layer, and electrically connecting the first and second metal segments. The second resistor includes fourth and fifth metal segments extending in the first direction in the first metal layer, and a sixth metal segment extending in the second direction in a third metal layer, and electrically connecting the fourth and fifth metal segments. The fourth and fifth metal segment have a width greater than a width of the first and second metal segments, the fourth metal segment is between the first and second metal segments and separated from the first metal segment by a distance, and a fourth and fifth metal segment separation is greater than the distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.