Display module package
US11942586B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2022 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Mar 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A display module package includes a semiconductor chip, a wiring member disposed on the semiconductor chip, including an insulating layer and a wiring layer, and contacting at least a portion of the semiconductor chip, a light emitting device array disposed on the wiring member and including a plurality of light emitting devices disposed on one surface, wherein the wiring member is between the semiconductor chip and the light emitting device, and a molding member disposed on the wiring member, sealing part of the light emitting device array, and having an opening for exposing the plurality of light emitting devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.