Stretchable/conformable electronic and optoelectronic circuits, methods, and applications
US11943864B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2023 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jan 6, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fabrication method for stretchable/conformable electronic and optoelectronic circuits and the resulting circuits. The method may utilize a variety of electronic materials including, but not limited to Silicon, GaAs, InSb, Pb Se, CdTe, organic semiconductors, metal oxide semiconductors and related alloys or hybrid combinations of the aforementioned materials. While a wide range of fabricated electronic/optoelectronic devices, circuits, and systems could be manufactured using the embodied technology, a hemispherical image sensor is an exemplary advantageous optoelectronic device that is enabled by this technology. Other applications include but are not limited to wearable electronics, flexible devices for the internet-of-things, and advanced imaging systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.