Circuit board with anti-corrosion properties, method for manufacturing the same, and electronic device having the same
US11943875B2 · kind B2 · utility
0Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2022 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | May 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09936
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.