System and method for embedding electronic components within an implant
US11944818B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2020 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Oct 18, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3756
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A system and method for embedded electronics within a medical implant comprising: an implant body; a circuitry surface, containing at least one electronic component, wherein the circuitry surface is at least partially embedded within a defined cavity of the implant along at least one path; sheathing, comprising a protective structure, wherein the at least partially embedded portion of the circuitry surface is enclosed within the sheathing; electronic components connected to, or directly on, the circuitry surface, comprising a set of electrodes and an antenna; and wiring, connecting the circuitry surface and electronic components. The system and method may further include a casing, wherein the casing is a sealed structure directly connected to the implant body including a printed a circuit board (PCB) contained within the casing itself.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.