High density neural implant cylindrical packaging
US11944822B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Oct 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09027
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A space-saving configuration for electronics is disclosed in which at least four circuit boards are arranged to form sides of a five-or-greater sided geometric prism that are perpendicular to a common plane. That is, they are stood up on their sides and connected with flex cable to approximate a cylinder. Each circuit board can include one or more sides with electrical components. The circuit boards make up at least half of the five-or-greater sided geometric prism such that the circuit boards wrap at least halfway around. A common connector on one of the circuit boards can be configured to receive power from an underlying motherboard, and flex cables connecting adjacent circuit boards in series distribute power received from the connector to each of the circuit boards in series.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.