Patent · US Active

Rocker polishing apparatus and method for full-aperture deterministic polishing of a planar part

US11945070B2 · kind B2 · utility

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1References
3Claims
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Key dates

Filing dateApr 17, 2020
Grant dateApr 2, 2024
Priority date
Expiry dateAug 28, 2041

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24B55/06
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A rocker polishing apparatus for full-aperture deterministic polishing of a planar part includes a control system, a substrate, a lifting plate, a polishing module and a measuring module. The polishing module and the measuring module are arranged on the substrate. The lifting plate is arranged between the polishing module and the measuring module. The polishing module includes a rocker mechanism, a polishing pad surface dressing mechanism, a polishing pad surface profile measuring apparatus and a continuous polishing pad mechanism. The apparatus allows the material removal rate distribution of the planar part and the surface profile of the planar part be in the normalized mirror symmetry relationship by controlling the material removal rate distribution on the surface of the planar part, thereby implementing the deterministic polishing of the planar part and ensuring the efficient convergence of the surface profile of the planar part in the polishing process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.