Curved surface lamination device
US11945202B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 12, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | May 12, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A curved surface lamination device, comprising a profiling jig (01), the profiling jig (01) comprising a base (101) and a profiling portion (102), with the profiling portion (102) being configured to support a carrier film (02), and the side of the base (101) facing away from the profiling portion (102) being provided with an opening; and a lower jig (03), comprising a first sinking groove (301), with part of the base (101) being inserted into the first sinking groove (301), such that the lower jig (03) encloses a hollow structure (E) with the base (101) at the opening position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.