Patent · US Active

Porous silicon material and method of manufacture

US11945726B2 · kind B2 · utility

1Cited by

22References

7Claims

0Family size

Assignee

ionobell, Inc. · US

Inventors

Robert C. Ionescu · San Jose, US
Chueh Liu · San Jose, US

Key dates

Filing date	Dec 13, 2022
Grant date	Apr 2, 2024
Priority date	—
Expiry date	Dec 13, 2042

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E60/10
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A method for forming a porous silicon material can include forming a mixture of silicon, carbon, and an etchant element, solidifying the mixture, removing the etchant element to form pores within the silicon material. The porous silicon material can include a distribution of pores with an average pore diameter between about 10 nm and 500 nm, wherein the silicon particle comprises a silicon carbon composite comprising 1-5% carbon by mass, 1-5% oxygen by mass, and 90-98% silicon by mass.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.