Hot melt adhesive composition and use thereof
US11945978B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
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Key dates
| Filing date | Jun 10, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Dec 8, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J167/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention is related to fast setting, bio-based hot melt adhesive compositions and use thereof. The bio-based hot melt adhesive compositions are based on renewable-based feedstock, making them environmentally friendly, and particularly suitable for sealing cardboard case, carton, and cardboards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.