Downhole method and apparatus
US11946331B2 · kind B2 · utility
0Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Sep 22, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K8/426
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method of sealing a subsurface bore comprises: locating a volume of thermite in the bore; locating a volume of alloy in the bore with the thermite; initiating reaction of the thermite to heat the alloy; and bringing the alloy to above the melting point of the alloy whereby the alloy flows and occludes the bore. The thermite may retain its initial form during or following reaction or may partially fluidise. The thermite may react to provide a platform that at least partially occludes the bore. The alloy may flow over a surface of the thermite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.