Mems sensor for sensing deformation by breaking contact between two electrodes
US11946741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2020 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Apr 2, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a MEMS deformation sensor for measuring a relative movement between two regions of a structure, the sensor comprising: —a first portion (2) and a second portion (3) that are movable with respect to one another along a direction of measurement (X); —a thrust element (4) mounted fixed with respect to the first portion; —a first electrode (A) and a second electrode (B) that are capable of being raised to different electrical potentials, each mounted fixed with respect to the second portion; —a connecting portion (I) forming an electrical link between the first electrode and the second electrode, the thrust element applying a load to the connecting portion when the first portion moves with respect to the second portion along the direction of measurement beyond a predetermined distance, the electrical link being broken under the effect of the load.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.