Method for measuring high resistivity test samples using voltages or resistances of spacings between contact probes
US11946890B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | May 12, 2022 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | May 12, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2648
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
To measure the resistance area product of a high resistivity layer using a microscopic multi point probe, the high resistivity layer is sandwiched between two conducting layers. A plurality of electrode configurations/positions is used to perform three voltage or resistance measurements. An equivalent electric circuit model/three layer model is used to determine the resistance area product as a function of the three measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.