Controlled randomization of electrochromic ablation patterns
US11947233B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2020 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Mar 11, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/362
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Various embodiments relate to an electrochromic (EC) device that is structured with surface contour features arranged according to a randomized pattern. For example, one or more conductive layers of an EC device may be structured with such surface ablations. In some embodiments, the randomized ablation pattern may comprise a randomized variation in one or more geometrical characteristics of a group of segments. In some examples, the geometrical characteristic(s) may include a distance characteristic, an orientation characteristic, and/or a shape characteristic, etc. According to various embodiments, the randomized ablation pattern may be configured to reduce diffraction and/or scatter of light incident on the surface ablations as compared to some other ablation patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.