Processes, systems and devices for metal filling of high temperature superconductor cables
US11948704B2 · kind B2 · utility
0Cited by
6References
38Claims
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Key dates
| Filing date | Nov 12, 2020 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Nov 12, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E40/60
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.