Feature selection through solder-ball population
US11948807B2 · kind B2 · utility
0Cited by
23References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Oct 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.