Heat sink for an electronic component
US11948856B2 · kind B2 · utility
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3References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 6, 2018 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Nov 6, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Various embodiments include a heat sink comprising: a base plate with an assembly surface for an electronic component; and a cooling structure bonded to the base plate increasing a surface area of the heat sink. The base plate comprises a metal-ceramic composite with a ceramic phase and a metallic phase. The cooling structure comprises a metal. A bond between the cooling structure and the base plate consists of a purely metallic bond between the cooling structure and the metallic phase of the base plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.