Bonded body, circuit board, and semiconductor device
US11948900B2 · kind B2 · utility
1Cited by
2References
21Claims
0Family size
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Key dates
| Filing date | Sep 2, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Oct 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonded body according to an embodiment includes a substrate, a metal member, and a bonding layer. The bonding layer is provided between the substrate and the metal member. The bonding layer includes a first particle including carbon, a first region including a metal, and a second region including titanium. The second region is provided between the first particle and the first region. A concentration of titanium in the second region is greater than a concentration of titanium in the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.