Solid-state imaging device and electronic device including coupling structures for electrically interconnecting stacked semiconductor substrates
US11948961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2022 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Jul 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/08145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid-state imaging device including a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked, a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked, and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. A first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate to each other does not include a coupling structure formed from the first substrate as a base over bonding surfaces of the first substrate and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.