Transparent multi-layer assembly and production method

US11949029B2 · kind B2 · utility

Assignee

• Albert-Ludwigs-Universitaet Freiburg · DE

Inventors

• Max Eickenscheidt · Freiburg (Elbe), DE
• Annette Mittnacht · Freiburg (Elbe), DE
• Thomas Stieglitz · Freiburg (Elbe), DE
• Marie T. Alt · Freiburg (Elbe), DE

Key dates

• Filing date: Sep 20, 2021
• Grant date: Apr 2, 2024
• Expiry date: Sep 27, 2042

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

A transparent multi-layer assembly includes a transparent carrier structure comprising a polymer material and an electrically conductive transparent layer comprising an electrically conductive oxide. A silicon carbide layer is arranged as an adhesion promoter between the transparent carrier structure and the electrically conductive transparent layer.