Systems and methods for addressing pumping of thermal interface materials in high-power laser systems
US11949204B2 · kind B2 · utility
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2References
31Claims
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Key dates
| Filing date | Feb 15, 2023 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Feb 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4087
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In various embodiments, laser devices feature means, such as fasteners, for attaching a laser package to a cooling plate, which allow motion of the laser package in response to thermal cycles resulting from operation of a beam emitter therewithin. Embodiments of the invention additionally or instead include laser devices featuring segmented barrier layers for electrically isolating the laser package from the cooling plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.